10 Layer ENIG FR4 Bofu Vias PCB
Nezve Mapofu Akavigwa Via PCB
Bofu Via:iyo inogonesa kubatana uye kuitisa pakati pemukati nekunze
Kuvigwa Via:iyo inogona kubatanidza uye kutungamira pakati pemukati akaturikidzana Blind Vias kazhinji maburi madiki ane dhayamita ye0.05mm ~ 0.15mm.Kune laser gomba kuumba, plasma etched gomba uye photoinduced gomba kugadzira, uye laser gomba kugadzira kunowanzo shandiswa.
HDI:High-density interconnection, non-mechanical drilling, micro-blind gole ring pazasi 6mil, mukati nekunze ma layers of wiring line wide/line gap iri pazasi 4mil, dhayamita yepad haina kukura kudarika 0.35mm inonzi HDI board production mode. .
Mapofu Vias
Blind Vias anoshandiswa kubatanidza imwe yekunze layer kune kanenge imwe yemukati layer.Imwe neimwe nhanho yegomba remapofu inoda kugadzira yakaparadzana yekuboora faira.Chiyero chegomba kudzika kusvika kuaperture (aspect ratio/hukobvu-diameter ratio) inofanira kuva shoma pane kana kuenzana na 1. Gomba rekiyi rinotara kudzika kwegomba, kureva kuti, kureba kwechinhambwe pakati pechitubu chekunze nechomukati.