14 Layer ENIG FR4 Kuvigwa Via PCB
Nezve Mapofu Akavigwa Via PCB
Bofu vias uye akavigwa vias inzira mbiri kugadza kubatana pakati akaturikidzana akadhindwa redunhu bhodhi.The bofu vias of rakadhindwa redunhu bhodhi vari mhangura-plated vias anogona kwakabatana okunze akaturikidzana kuburikidza vakawanda yomukati layer.Mugodhi unobatanidza maviri kana anopfuura matinji emukati asi haupindi kunze.Shandisa microblind vias kuwedzera mutsara wekugovera density, kunatsiridza radio frequency uye electromagnetic kupindira, kupisa conduction, kuiswa kune maseva, mbozha nhare, dijita kamera.
Akavigwa Vias PCB
The akavigwa Vias rinobatanidza maviri kana kupfuura yomukati akaturikidzana asi haapindi nekunze layer
| Min Hole Diameter/mm | Min ring/mm | kuburikidza-mu-pedhi Diameter/mm | Maximum Diameter/mm | Aspect ratio | |
| Blind Vias(yakajairika) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
| Blind Vias(special product) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
Bofu Vias PCB
Blind Vias ndeyekubatanidza yekunze layer kune kanenge imwe yemukati layer
|
| Min.Gomba Diameter/mm | Minimum mhete/mm | kuburikidza-mu-pedhi Diameter/mm | Maximum Diameter/mm | Aspect ratio |
| Bofu Vias(mechanical drilling) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
| Mapofu Vias(Laser drilling) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
The mukana bofu Vias uye akavigwa Vias kuti mainjiniya ndiko kuwedzera chikamu density pasina kuwedzera layer nhamba uye kukura redunhu bhodhi.Kune zvigadzirwa zvemagetsi zvine nzvimbo yakamanikana uye diki dhizaini kushivirira, bofu gomba dhizaini isarudzo yakanaka.Kushandiswa kwemakomba akadaro kunobatsira dhizaini dhizaini kugadzira inonzwisisika gomba / padhi reshiyo kudzivirira yakawandisa reshiyo.
