4 Layer ENIG FR4 Half Hole PCB

Kuboora -- Chemical Copper -- Full Plate Copper -- Image Transfer -- Graphics Electroplating -- Defilm -- Etching -- Stretch Soldering -- Half Hole Surface Coating (Yakaumbwa Panguva Imwe chete neProfile).

Iyo metallized hafu gomba inochekwa nepakati mushure mekunge gomba rakatenderera raumbwa.Zviri nyore kuoneka chiitiko chemhangura waya yakasara uye mhangura yeganda warping muhafu yegomba, iyo inokanganisa basa rehafu yegomba uye inotungamira kuderera kwekuita kwechigadzirwa uye goho.Kuti ukunde hurema huri pamusoro, huchaitwa zvinoenderana neanotevera maitiro matanho emetalized semi-orifice PCB:

1. Kugadzira hafu yegomba kaviri V rudzi banga.

2. Muchidimbu chechipiri, gomba rinotungamirira rinowedzerwa pamucheto wegomba, ganda remhangura rinobviswa mberi, uye burr inoderedzwa.Migero inoshandiswa kuchera kuti iwedzere kumhanya kwekudonha.

3. Mhangura yemhangura pane substrate, kuitira kuti chigadziko chemhangura chemhangura pamadziro egomba regomba rakatenderera pamucheto weplate.

4. Dunhu rekunze rinoitwa nekumanikidza firimu, kuratidzwa uye kukura kweiyo substrate, uye ipapo iyo substrate inoputirwa nemhangura uye tini kaviri, kuitira kuti mhangura yemhangura pamadziro egomba regomba rakatenderedza pamucheto we. ndiro yakakora uye mhangura yemhangura yakafukidzwa netini layer ine anti-corrosion effect;

5. Half gole kugadzira ndiro mupendero denderedzwa gomba rakachekwa nepakati kuita hafu yegomba;

6. Kubvisa firimu kuchabvisa anti-plating firimu yakatsikirirwa mukugadzirisa kwefirimu kudzvinyirira;

7. Nyora substrate, uye bvisa yakafumurwa etching yemhangura pachikamu chekunze che substrate mushure mekubvisa firimu; Tin peeling Iyo substrate inopepetwa kuitira kuti tini ribviswe pamadziro ane perforated uye copper layer iri pa semi- madziro ane perforated ari pachena.

8. Mushure mekuumba, shandisa tepi dzvuku kunamatira mahwendefa eyuniti pamwe chete, uye pamusoro pe alkaline etching line kubvisa maburrs.

9. Mushure mechipiri chemhangura yemhangura uye tin plating pa substrate, gomba rakatenderera pamucheto weplate rinochekwa nepakati kuita hafu yegomba.Nekuti mhangura yemadziro egomba yakafukidzwa netini layer, uye mhangura yemhangura yegomba madziro yakanyatsobatanidzwa nemhangura yekunze kweiyo substrate, uye simba rekusunga rakakura, mhangura yemhangura pagomba. rusvingo runogona kudziviswa zvinobudirira kana uchicheka, sekudhonza kana chiitiko chemhangura warping;

10. Mushure mekupera kwehafu-gomba kuumba uye ipapo kubvisa firimu, uye ipapo etch, mhangura pamusoro oxidation hazvizoitiki, zvinobudirira kudzivisa kuitika kwemhangura zvakasara uye kunyange pfupi redunhu chiitiko, kuvandudza goho resimbi semi-gomba PCB. .