6 Layer ENIG Impedance Kudzora PCB
Nezve Multilayer PCB
PCB Transaction process
Yakasiyana-siyana yePCB Maitiro
Multilayer PCB
Hudiki hwehupamhi hwemutsara uye kupatsanurwa kwemutsara 3/3mil
BGA 0.4pitch, shoma gomba 0.1mm
Inoshandiswa mukutonga kwemaindasitiri uye zvemagetsi zvevatengi
Half Hole PCB
Hapana chasara kana kuputika kwemunzwa wemhangura muhafu yegomba
Bhodhi remwana rebhodhi reamai rinochengetedza zvibatanidza uye nzvimbo
Inoshandiswa kuBluetooth module, chiratidzo chinogamuchira
Mapofu Akavigwa Via PCB
Shandisa micro-mapofu maburi kuti uwedzere kusimba kwemutsara
Kuvandudza redhiyo frequency uye electromagnetic kupindira, kupisa conduction
Nyorera kumaseva, nharembozha, uye makamera edhijitari
Via-in-Pad PCB
Shandisa electroplating kuzadza maburi / resin plug makomba
Dzivisa solder paste kana flux inoyerera mumakomba emapani
Dzivirira maburi ane tin bead kana inki pad inotungamira pakupinza
Bluetooth module yevatengi zvemagetsi indasitiri