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4 Layer ENIG FR4 Half Hole PCB
Layer: 4
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 9/4mil
Inner layer W/S: 7/4mil
Ukobvu: 0.8mm
Min.gomba dhayamita: 0.2mm
Special process:Impedance, hafu gomba
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6 Layer ENIG Impedance Half Hole PCB
Layer: 6
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Ukobvu: 1.2mm
Min.gomba dhayamita: 0.2mm
Special process:Impedance, hafu gomba -
4 Layer HASL FR4 Half Hole PCB
Layer: 4
Kupera kwepamusoro: LF-HASL
Nheyo yezvinhu: FR4
Kunze Layer W/S: 9/6mil
Yemukati layer W/S: 9/5mil
Ukobvu: 0.8mm
Min.gomba dhayamita: 0.3mm
Special process:half hole -
4 Layer ENIG FR4 Half Hole PCB
Layer: 4
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 4/3mil
Inner layer W/S: 6/4mil
Ukobvu: 0.8mm
Min.gomba dhayamita: 0.2mm
Special process:half hole -
4 Layer ENIG FR4 Half Hole PCB
Layer: 4
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 8/4mil
Yemukati layer W/S: 8/4mil
Ukobvu: 0.6mm
Min.gomba dhayamita: 0.2mm
Special process:half hole -
4 Layer ENIG Impedance Half Hole PCB
Layer: 4
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 6/4mil
Inner layer W/S: 6/4mil
Ukobvu: 0.4mm
Min.gomba dhayamita: 0.6mm
Special process:Impedance,hafu gomba -
2 Layer HASL FR4 Half Hole PCB
Layer: 2
Kupera kwepamusoro: LF-HASL
Nheyo yezvinhu: FR4
Yekunze Layer W/S: 9/5mil
Ukobvu: 1.6mm
Min.gomba dhayamita: 0.4mm
Chirongwa chakakosha: hafu yegomba -
8 Layer ENIG FR4 Half Hole PCB
Layer: 8
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 4/3mil
Inner layer W/S: 5/4mil
Ukobvu: 1.6mm
Min.gomba dhayamita: 0.2mm -
4 Layer ENIG FR4 Half Hole PCB
Layer: 4
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Ukobvu: 0.8mm
Min.gomba dhayamita: 0.15mm
