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16 Layer ENIG Press Fit Hole PCB
Layer: 16
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Ukobvu: 3.0mm
Min.gomba dhayamita: 0.35mm
Saizi: 420 × 560mm
Kunze Layer W/S: 4/3mil
Inner layer W/S: 5/4mil
Chiyero chezvikamu: 9:1
Yakakosha maitiro: via-mu-pad, impedance control, press fit gole
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6 Layer ENIG FR4 Via-In-Pad PCB
Layer: 6
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Yekunze Layer W/S: 4/3.5mil
Inner layer W/S: 4/3.5mil
Ukobvu: 2.0mm
Min.gomba dhayamita: 0.25mm
Yakakosha maitiro: via-mu-pad, impedance control
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6 Layer ENIG FR4 Via-In-Pad PCB
Layer: 6
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
W/S: 5/4mil
Ukobvu: 1.0mm
Min.gomba dhayamita: 0.2mm
Special process: via-in-pad
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6 Layer ENIG Via-In-Pad PCB
Layer: 6
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Yekunze Layer W/S: 7/3.5mil
Inner layer W/S: 7/4mil
Ukobvu: 0.8mm
Min.gomba dhayamita: 0.2mm
Special process: via-in-pad
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8 Layer ENIG FR4 Via-In-Pad PCB
Layer: 8
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Ukobvu: 1.2mm
Min.gomba dhayamita: 0.15mm
Special process: via-in-pad
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6 Layer FR4 ENIG Via In Pad PCB
Layer: 6
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Yekunze Layer W/S: 4/3.5mil
Inner layer W/S: 4.5/3.5mil
Ukobvu: 1.0mm
Min.gomba dhayamita: 0.2mm
Special process: via in pad
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8 Layer ENIG FR4 Via-In-Pad PCB
Layer: 8
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Yekunze Layer W/S: 4/3.5mil
Inner layer W/S: 4/3.5mil
Ukobvu: 1.0mm
Min.gomba dhayamita: 0.2mm
Yakakosha maitiro: via-mu-pad, impedance control
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10 Layer ENIG FR4 Via In Pad PCB
Layer: 10
Kupera kwepamusoro: ENIG
zvinhu: FR4 Tg170
Mutsara wekunze W/S: 10/7.5mil
Mutsara wemukati W/S: 3.5/7mil
Bhodhi ukobvu: 2.0mm
Min.gomba dhayamita: 0.15mm
Plug hole: kuburikidza nekuzadza plating
