Kukurukurirana Equipment PCB
Kuti upfupise chinhambwe chekufambisa kwechiratidzo uye kuderedza kurasikirwa kwekutapurirana kwechiratidzo, iyo 5G yekutaurirana bhodhi.
Nhanho nhanho kusvika kune yakakwirira-density wiring, yakanaka waya spacing,tiye kusimudzira kutungamira kweiyo micro-aperture, yakatetepa mhando uye yakakwirira kuvimbika.
In-deep optimization yekugadzira tekinoroji uye nzira yekugadzira masingi nemaseketi, kupfuura zvipingamupinyi zvehunyanzvi.Iva akanakisa mugadziri we5G yepamusoro-yekupedzisira kutaurirana PCB board.
Kukurukurirana Indasitiri Uye PCB Zvigadzirwa
| Indasitiri yekukurukurirana | Main midziyo | Inodiwa PCB zvigadzirwa | PCB chimiro |
| Wireless network | Kukurukurirana base station | Backplane, high-speed multilayer board, high-frequency microwave board, multi-function metal substrate | Metal base, yakakura saizi, yakakwira multilayer, yakakwirira frequency zvinhu uye yakasanganiswa voltage |
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Transmission network | OTN transmission equipment, microwave transmission equipment backplane, high-speed multilayer board, high-frequency microwave board. | Backplane, high-speed multilayer board, high-frequency microwave board | High kumhanya zvinhu, saizi hombe, yakakwira multilayer, yakakwira density, kudhiraivha kumashure, rigid-flex joint, high frequency material uye yakasanganiswa kudzvinyirirwa. |
| Kukurukurirana kwemashoko | Router, switch, sevhisi / kuchengetedza Devic | Backplane, high-speed multilayer board | High-speed material, saizi hombe, high multi-layer, high density, back drill, rigid-flex musanganiswa |
| Yakagadziriswa network Broadband | OLT, ONU uye imwe fiber-kune-iyo-imba michina | High-speed material, saizi hombe, high multi-layer, high density, back drill, rigid-flex musanganiswa | Multilay |
PCB Yezvekutaurirana Equipment Uye Nharembozha Terminal
Midziyo Yekukurukurirana
Mobile Terminal
Maitiro Kuomerwa Kwepamusoro Frequency uye High Speed PCB Board
| Yakaoma point | Matambudziko |
| Kurongeka kwechokwadi | Iyo chaiyo yakaomesesa, uye iyo interlayer alignment inoda kushivirira convergence.Rudzi urwu rwekusangana rwunonyanya kuomarara kana saizi yeplate yachinja |
| STUB (Impedance discontinuity) | Iyo STUB yakaoma, ukobvu hweplate hunonetsa, uye tekinoroji yekuchera kumashure inodiwa |
| Impedance chaiyo | Pane dambudziko guru rekugadzirisa: 1. Etching factors: zviduku zviri nani, etching accuracy tolerance inotungamirirwa ne + /-1MIL ye lineweights ye10mil uye pasi, uye + /-10% nokuda kwekutsungirira kwemutsara pamusoro pe10mil.2. Zvinodiwa zvehupamhi hwemutsara, kureba kwemutsara uye kukora kwemutsara zvakakwirira.3. Vamwe: wiring density, chiratidzo che interlayer kupindira |
| Kuwedzera kudiwa kwekurasikirwa kwechiratidzo | Pane dambudziko guru pakurapa kwepamusoro kwezvose copper clad laminates;kushivirira kwakakwirira kunodiwa kune PCB ukobvu, kusanganisira kureba, hupamhi, ukobvu, verticality, uta uye kukanganisa, nezvimwe. |
| Saizi iri kuramba ichikura | Iyo machinability inowedzera kuipa, iyo maneuverability inowedzera, uye gomba rebofu rinoda kuvigwa.Mutengo unowedzera2. Kururama kwekugadzirisa kunonyanya kuoma |
| Nhamba yezvikamu inova yakakwirira | Hunhu hwe denser mitsara uye kuburikidza, yakakura unit saizi uye yakatetepa dielectric layer, uye zvakanyanya kuomesera zvinodiwa zvemukati nzvimbo, interlayer alignment, impedance control uye kuvimbika. |
Zvakawanda Zvakaitika Mukugadzira Kukurukurirana Bhodhi yeHUIHE Circuits
Zvinodiwa kune high density:
Mhedzisiro yecrosstalk (ruzha) inodzikira nekudzikira kwemutsara / nzvimbo.
Strict impedance zvinodiwa:
Hunhu hwekuita impedance kuenzanisa ndicho chinonyanya kukosha chinodiwa chepamusoro frequency microwave board.Iyo yakakura iyo impedance, ndiko kuti, iyo yakakura kugona kudzivirira chiratidzo kubva pakupinda mukati meiyo dielectric layer, inokurumidza kufambisa kwechiratidzo uye kudiki kurasikirwa.
Iko kurongeka kwekugadzira tambo yekufambisa kunodiwa kuve kwakakwira:
Kufambiswa kwechiratidzo chepamusoro-frequency chiratidzo chakanyanya kuomarara kune hunhu hweiyo impedance yewaya yakadhindwa, ndiko kuti, iko kurongeka kwekugadzira kwetambo yekufambisa kazhinji kunoda kuti mupendero wetambo yekufambisa unofanirwa kuve wakanyatso tsvinda, pasina burr, notch, kana waya. kuzadza.
Machining zvinodiwa:
Chokutanga pane zvose, zvinhu zve-high-frequency microwave board zvakasiyana zvikuru ne epoxy glass cloth material yebhodhi rakadhindwa;chechipiri, machining nemazvo eiyo high-frequency microwave board yakakwira zvakanyanya kupfuura iyo yebhodhi yakadhindwa, uye iyo general shape kushivirira ndeye ± 0.1mm (munyaya yekurongeka kwepamusoro, kushivirira kwechimiro ± 0.05mm).
Mixed pressure:
Iko kushandiswa kwakasanganiswa kwe-high-frequency substrate (PTFE kirasi) uye yakakwirira-speed substrate (PPE kirasi) inoita iyo yakakwirira-frequency yakakwirira-yekumhanya yedunhu bhodhi haina kungova nenzvimbo huru yekuitisa, asiwo ine yakagadzikana dielectric inogara, yakakwirira dielectric shielding zvinodiwa. uye kupisa kwepamusoro kuramba.Panguva imwecheteyo, chiitiko chakashata che delamination uye kusanganiswa kudzvinyirirwa warping kunokonzerwa nekusiyana kwekunamatira uye kupisa kwekuwedzera coefficient pakati pemahwendefa maviri akasiyana inofanira kugadziriswa.
Kufanana kwepamusoro kwejasi kunodiwa:
Iyo hunhu impedance yemutsetse wekutapurirana weiyo yakakwira frequency microwave board inokanganisa zvakananga kutapurirana kunaka kweiyo microwave chiratidzo.Iko kune humwe hukama pakati peiyo hunhu impedance uye ukobvu hwemhangura foil, kunyanya kune microwave ndiro ine maburi ane simbi, ukobvu hwekuputira haungokanganisa kukora kwemhangura yemhangura, asi zvakare kunokanganisa kurongeka kwewaya mushure mekucheka. .saka, ukuru uye kufanana kwehuputi hwehuputi hunofanira kunyatsodzorwa.
Laser micro-kuburikidza negomba kugadzirisa:
Chinhu chakakosha chepamusoro-density board yekutaurirana ndeye micro-kuburikidza negomba rine bofu / rakavigwa gomba chimiro (aperture ≤ 0.15mm).Parizvino, laser processing ndiyo nzira huru yekugadzira micro-kuburikidza nemakomba.Chiyero chedhayamita yeburi kuburikidza negomba kusvika kudhayamita yeplate yekubatanidza inogona kusiyana kubva kune mutengesi kune mutengesi.Huyero hwedhayamita hwepakati pegomba kuenda kuplate yekubatanidza hune hukama nekumisikidza kwechibhorani, uye kuwanda kwezvikamu zviripo, kutsauka kungave kwakanyanya.parizvino, inowanzo gamuchirwa kuteedzera nzvimbo yakanangwa dhizaini.Kune yakakwirira-density wiring, pane connectionless disc kuburikidza nemakomba.
Kurapa kwepamusoro kwakanyanya kuoma:
Nekuwedzera kwehuwandu, kusarudzwa kwehutano hwepamusoro kunowedzera kukosha, uye kupfekedza nemagetsi akanaka conductivity uye kuonda kwakaonda kune simba shoma pane chiratidzo."Kushata" kwewaya kunofanirwa kuenderana nekobvu yekutapurirana iyo chiratidzo chekufambisa chinogona kubvuma, zvikasadaro zviri nyore kuburitsa yakakomba chiratidzo "yakamira wave" uye "reflection" zvichingodaro.Iyo molecular inertia yeakakosha substrates akadai sePTFE inoita kuti zviome kusanganisa nemhangura foil, saka yakakosha kurapwa kwepamusoro kunodiwa kuti uwedzere kushata kwepamusoro kana kuwedzera firimu rinonamira pakati pemhangura foil nePTFE kuvandudza kunamatira.
