Sei tsika PCB yemhangura plating pamusoro bubble?

Sei tsika PCB yemhangura plating pamusoro bubble?

Custom PCBkubvongodza kwepamusoro ndeimwe yeakajairika kunaka kwemhando mukugadzira kwePCB.Nekuda kwekuoma kwePCB kugadzirwa kwemaitiro uye kugadzirisa kwemaitiro, kunyanya mumakemikari emvura kurapwa, zvakaoma kudzivirira kukanganisa kubhuroka pabhodhi.

Kubhuya pamusoroPCB bhodhindiro dambudziko rekushaya simba rekubatanidza pabhodhi, uye nekuwedzera, dambudziko remhando yepamusoro pabhodhi, iro rinosanganisira zvinhu zviviri:

1. PCB pamusoro pehutsanana dambudziko;

2. Micro roughness (kana pamusoro pesimba) yePCB pamusoro;matambudziko ese anotubuka ari pabhodhi redunhu anogona kupfupikiswa sezvikonzero zviri pamusoro.Simba rinosunga pakati pekuputira rakashata kana rakaderera zvakanyanya, mukugadzirwa kunotevera uye kugadzirisa maitiro uye nzira yegungano yakaoma kurwisa kugadzirwa nekugadzirisa nzira inogadzirwa mukuputira kunetseka, kushushikana kwemagetsi uye kushushikana kwekushisa, zvichingodaro, zvichikonzera zvakasiyana. madhigirii ekuparadzanisa pakati pechiitiko chekuputira.

Zvimwe zvinhu zvinokonzeresa hurombo hwepamusoro mukugadzirwa kwePCB uye kugadzirisa zvinopfupikiswa sezvizvi:

Tsika PCB substrate - mhangura-clad ndiro process kurapa matambudziko;Kunyanya kune mamwe matete substrates (kazhinji ari pasi pe 0.8 mm), nekuti iyo substrate kuomarara haina kusimba, isina kunaka shandisa brashi brashi ndiro muchina, inogona kutadza kunyatso bvisa iyo substrate kuitira kudzivirira pamusoro oxidation yemhangura foil mukugadzira. uye kugadzirisa uye yakakosha dhizaini yekugadzira, nepo iyo yakatetepa, bhurashi ndiro iri nyore kubvisa, asi kugadzirwa kwemakemikari kwakaoma, Naizvozvo, zvakakosha kutarisisa kudzora mukugadzira uye kugadzirisa, kuti usakonzerese dambudziko. yekupupa kunokonzerwa nekushaya simba kwekusunga pakati pe substrate copper foil nekemikari mhangura;kana mukati mutete mutsvuku wasviba, pachange pasisina kusviba uye kusviba, ruvara rusina kuenzana, uye kusasviba zvakanaka kwenzvimbo.

PCB bhodhi pamusoro mukuita machining (kuchera, lamination, chigayo, etc.) kunokonzerwa nemafuta kana imwe mvura guruva kusvibiswa kwepamusoro kurapwa kwakashata.

3. PCB yemhangura inonyura bhurashi ndiro haina kunaka: kudzvanywa kwendiro yekukuya mhangura isati yanyura yakakurisa, zvichiita kuti gomba rive deformation, uye fillet yemhangura pagomba uye kunyange chigadziko chinodonha pagomba, izvo zvinokonzeresa bubble. chiitiko pagomba mukugadzira mhangura kunyura, plating, tin spraying uye welding;kunyangwe iyo bhurashi ndiro isingakonzere kuvuza kweiyo substrate, iyo yakawandisa bhurashi ndiro inowedzera kushata kwegomba remhangura, saka mukuita kweiyo micro-corrosion coarsening, iyo foil yemhangura iri nyore kugadzira yakawandisa coarsening chiitiko, ipapo. ichavawo imwe njodzi yehutano;saka, kutarisisa kunofanirwa kubhadharwa pakusimbisa kutonga kwebhurashi ndiro process, uye bhurashi ndiro process paramita inogona kugadziridzwa kune yakanyanya kunaka kuburikidza nekupfeka chiratidzo bvunzo uye yemvura firimu bvunzo.

4. Yakashambidzwa PCB dambudziko: nekuti inorema mhangura electroplating processing inofanira kupfuura yakawanda kemikari mvura mvura mushonga kugadzirisa, marudzi ose acid-base the non-polar organic solvent yakadai zvinodhaka, bhodhi kugeza kumeso kwete kuchena, kunyanya inorema copper kugadzirisa kuwedzera maajenti, kwete chete anogona kukonzera kusvibiswa kwemuchinjiko, zvakare kuchaita kuti bhodhi ritarise kugadzirisa kwenzvimbo kwakashata kana kushata kwekurapa maitiro, kukanganisa kwekusaenzana, kukonzeresa kumwe kwesimba rinosunga;saka, kutarisa kunofanira kubhadharwa pakusimbisa kutonga kwekushambidza, kunyanya kusanganisira kutonga kwekuyerera kwemvura yekuchenesa, kunaka kwemvura, nguva yekugeza, uye nguva yekudonha kweplate parts;kunyanya munguva yechando, tembiricha yakaderera, mhedzisiro yekugeza ichaderedzwa zvakanyanya, kunyanya kutariswa kunofanirwa kubhadharwa kune kutonga kwekugeza.