10 Layer ENIG FR4 Via In Pad PCB
Via In Pad PCB
MuPCB dhizaini, buri-buri i spacer ine buri diki rakaputirwa mubhodhi redunhu rakadhindwa kubatanidza njanji dzemhangura pane imwe neimwe yebhodhi.Pane imwe mhando yeburi rinodaidzwa kuti microhole, iyo inongove negomba remapofu rinoonekwa pane imwe nzvimbo yehigh-density multilayer PCBkana gomba risingaoneki rakavigwa mune chero nzvimbo.Iko kusuma uye kushandiswa kwakakura kwepini-yakakwirira-density zvikamu, pamwe nekudiwa kwediki PCBS, zvakaunza matambudziko matsva.Naizvozvo, mhinduro iri nani kune dambudziko iri kushandisa yazvino asi yakakurumbira PCB yekugadzira tekinoroji inonzi "Via muPad".
Mumagadzirirwo azvino ePCB, kushandiswa nekukurumidza kwepadhi padhi kunodiwa nekuda kwekudzikira kwenzvimbo yechikamu chetsoka uye miniaturization yePCB chimiro coefficients.Zvinotonyanya kukosha, inogonesa kufambiswa kwemasaini munzvimbo shoma dzePCB dhizaini sezvinobvira uye, kazhinji, inodzivirira kudarika perimeter inogarwa nemudziyo.
Pass-through pads anobatsira zvakanyanya mukumhanyisa dhizaini sezvo achidzikisa kureba kwetrack uye nekudaro inductance.Zviri nani utarise kuti uone kana PCB mugadziri wako ane midziyo yakakwana kugadzira bhodhi rako, sezvo izvi zvingaita mari yakawanda.Nekudaro, kana iwe usingakwanise kuisa kuburikidza ne gasket, isa zvakananga uye shandisa anopfuura imwe kuderedza inductance.
Uye zvakare, iyo pass pad inogona zvakare kushandiswa mune isina kukwana nzvimbo, senge muiyo micro-BGA dhizaini, iyo isingakwanise kushandisa yechinyakare fan-out nzira.Hapana mubvunzo kuti kukanganiswa kweiyo kuburikidza negomba muwelding disc idiki, nekuda kwekushandisa muwelding disc, kukanganisa pamutengo kwakakura.Iyo yakaoma yekugadzira maitiro uye mutengo wezvinhu zvakakosha zvinhu zviviri zvikuru zvinokanganisa mutengo wekugadzira we conductive filler.Kutanga, Via muPad inhanho yekuwedzera muPCB yekugadzira maitiro.Nekudaro, sezvo huwandu hwematanho hunodzikira, ndozvinoitawo mari yekuwedzera yakabatana neVia muPad tekinoroji.
Zvakanakira Via In Pad PCB
Via in pad PCBs ane akawanda mabhenefiti.Chekutanga, inofambisa yakawedzera density, kushandiswa kwemapakeji akakwenenzverwa, uye kuderedzwa inductance.Chii zvakare, mukuita kuburikidza ne pad, via inoiswa zvakananga pazasi pemapedhi echishandiso, ayo anogona kuwana yakakura chikamu density uye yepamusoro nzira.Saka inogona kuchengetedza yakakura huwandu hwePCB nzvimbo nepadhi yePCB mugadziri.
Kuenzaniswa nemapofu nemavhairasi uye akavigwa vias, via in pad ine zvinotevera zvakanakira:
Inokodzera ruzivo daro BGA;
Kuvandudza PCB density, chengetedza nzvimbo;
Kuwedzera kupisa kupisa;
Iyo flat uye coplanar ine chikamu accessories inopihwa;
Nekuti hapana tsvakiridzo yeimbwa bone pad, inductance yakaderera;
Wedzera simba remagetsi echiteshi chechiteshi;
Via In Pad Chikumbiro cheSMD
1. Sunga gomba neresin woriisa nemhangura
Inoenderana nediki BGA VIA muPad;Chekutanga, maitiro acho anosanganisira kuzadza maburi nezvinhu zvinoitisa kana zvisingaite, wobva waisa maburi pamusoro kuti upe nzvimbo yakatsetseka kune inogoneka.
Gomba rekupfuura rinoshandiswa padhizaini yekuisa zvinhu pagomba rekupfuura kana kutambanudza majoini ekutengesa kune yekupfuura hole yekubatanidza.
2. Ma microholes nemakomba akaputirwa padhi
Microholes IPC yakavakirwa maburi ane dhayamita isingasviki 0.15mm.Inogona kunge iri kuburikidza negomba (inoenderana neaspect ratio), zvisinei, kazhinji microhole inobatwa segomba rebofu pakati pezvikamu zviviri;Mazhinji ema microholes anocherwa ne lasers, asi vamwe vanogadzira PCB vari kucherawo nema mechanical bits, anononoka asi akachekwa zvinoyevedza uye zvakachena;Iyo Microvia Cooper Zadza maitiro ndeye electrochemical deposition process ye multilayer PCB kugadzira maitiro, anozivikanwawo seCapped VIas;Kunyangwe maitiro acho akaoma, anogona kugadzirwa kuve HDI PCBS iyo vazhinji PCB vanogadzira vanozadzwa ne microporous copper.
3. Vhara gomba ne welding resistance layer
Iyo yemahara uye inoenderana nehombe solder SMD pads;Iyo yakamisikidzwa LPI kuramba welding process haigone kuumba yakazadzwa negomba pasina njodzi yekushama mhangura mugomba.Kazhinji, inogona kushandiswa mushure mekudhindwa kwechipiri skrini nekuisa UV kana kupisa-yakapora epoxy solder zvinopikisa mumakomba kuti zvivhare;Inodanwa kuburikidza nekuvhara.Kuburikidza ne-gomba plugging ndiko kuvharika kwemaburi-ne-maburi ane chinodzivirira kudzivirira kubuda kwemhepo paunenge uchiyedza ndiro, kana kudzivirira mapfupi maseketi ezvinhu padyo nepamusoro peplate.
