2 Layer OSP F4B Yakakwirira Frequency PCB
Nezve F4B High Frequency PCB
Wangling F4B yakavakirwa pamagetsi ekuita zvinodiwa zvema microwave maseketi,
Imhando yeakanakisa microwave yakadhindwa redunhu bhodhi ine yakanaka magetsi zvivakwa uye yakakwirira mechanical simba.
Dhizaini YeF4B Yepamusoro Frequency PCB
Mukugadzirwa kwePCB yakakwira-frequency, vagadziri vanowanzo tarisa zvakanyanya kune dielectric garage (DK) uye tangent kurasikirwa (DF) yePCB pakusarudza zvinhu, uye chete teerera kune ukobvu hwemhangura foil pakusarudza foil yemhangura, inova. zviri nyore kufuratira pesvedzero yemhando dzakasiyana dzemhangura foil roughness pamagetsi ezvigadzirwa.
SEM kuongororwa kweiyo micro morphology yemhando dzakasiyana dzemhangura foil uye dielectric contact surface inoratidza kuti kushata kwemhando dzakasiyana dzemhangura foil kwakasiyana.Mukugadzirwa kweiyo microstrip mutsara, iyo roughness yemhangura foil uye dielectric yekubata kumeso kuchakanganisa zvakananga kurasikirwa kwekuisa kweyese tambo yekutapurirana.
Material Parameters yeF4B PCB
Wangling F4B yakagadzirwa nemhando yepamusoro zvinhu zvinoenderana nemagetsi ekuita zvinodiwa zvema microwave maseketi.Iine maitiro akanaka emagetsi uye simba rakakwirira remagetsi.Iyo yakanakisa microwave yakadhindwa yedunhu subgrade board.Normal 15N/cm inogara yakanyorova kupisa uye 260 ℃ ± 2 ℃ fusion welding zvinhu kuchengetedza 20 masekonzi pasina furo, hapana stratification uye peeling simba ≥12 N/cm.
| Rudzi rwezvinhu | Model | Kuzadza Material | Dk (@10GHZ) | Df (@10GHZ) |
| F4B-1/2 | PTFE+Glasi jira | 2.55/2.65 | ≤0.001 | |
| F4BK | F4BK225 | PTFE+Glasi jira | 2.55 | ≤0.001 |
| F4BK265 | PTFE+Glasi jira | 2.65 | ≤0.001 | |
| F4BK300 | PTFE+Glasi jira | 3 | ≤0.001 | |
| F4BK350 | PTFE+Glasi jira | 3.5 | ≤0.001 | |
| F4BM | F4BM220 | PTFE+Glasi jira | 2.2 | ≤0.007 |
| F4BM225 | PTFE+Glasi jira | 2.55 | ≤0.007 | |
| F4BM265 | PTFE+Glasi jira | 2.65 | ≤0.007 | |
| F4BM300 | PTFE+Glasi jira | 3 | ≤0.007 | |
| F4BM350 | PTFE+Glasi jira | 3.5 | ≤0.007 |
