8 Layer ENIG FR4 Multilayer PCB

1. Kuoma kwe interlayer alignment

Nekuda kweakawanda akaturikidzana e multilayer PCB board, iyo calibration inodiwa yePCB layer iri pamusoro nepamusoro.Kazhinji, kushivirira kwekuenzanisa pakati pezvikamu kunodzorwa pa75um.Zvakanyanya kuoma kudzora kurongeka kwemultilayer PCB board nekuda kwehukuru hukuru hweyuniti, tembiricha yakakwira uye hunyoro mumusangano wekushandura mifananidzo, kudhumhana kunokonzeresa kunokonzerwa nekusawirirana kwemabhodhi epakati akasiyana, uye mamiriro ekuisa pakati pezvikamu. .

2. Kuoma kwekugadzirwa kwedunhu remukati

Iyo multilayer PCB bhodhi inotora zvakakosha zvinhu zvakaita seyakakwira TG, kumhanya kwakakwira, kukwira kwakawanda, mhangura inorema, yakaonda dielectric layer uye zvichingodaro, izvo zvinoisa pamberi pepamusoro zvinodiwa zvemukati wedunhu kugadzirwa uye graphic size control.Semuenzaniso, kutendeseka kweiyo impedance chiratidzo chekufambisa kunowedzera kuoma kwemukati wedunhu kugadzirwa.Iyo yakafara uye mitsara yepakati idiki, iyo yakavhurika yedunhu uye pfupi yedunhu inowedzera, chiyero chekupasa chakaderera;neakawanda akatetepa mitsara masiginecha, iyo yemukati AOI yemukati mukana wekuona kuvuza unowedzera.Iyo yemukati core ndiro yakatetepa, iri nyore kuunyana, isina kunaka kuratidzwa, nyore kupeta etching;multilayer PCB inowanzoita system board, ine yakakura unit saizi uye yakakwira zvirahwe mutengo.

3. Matambudziko mukugadzira lamination uye yakakodzera kugadzira

Mazhinji emukati epakati mabhodhi uye semi-akaporeswa mabhodhi akaiswa pamusoro, ayo anowanzo kukanganiswa senge siraidhi ndiro, lamination, resin void uye bubble rasara mukugadzira zvitambi.Mune dhizaini yechimiro chelaminated, kupisa kupisa, kumanikidza kuramba, glue zvemukati uye dielectric ukobvu hwezvinhu zvinofanirwa kutariswa zvizere, uye inonzwisisika zvinhu kudzvanya chirongwa che multilayer plate inofanira kuitwa.Nekuda kwehuwandu hukuru hwematanho, iyo yekuwedzera uye kudzora kudzora uye saizi coefficient muripo hazvienderane, uye yakaonda inter-layer insulating layer iri nyore kutungamira mukukundikana kweiyo inter-layer kuvimbika bvunzo.

4. Matambudziko ekugadzirwa kwekuchera

Iko kushandiswa kweyakakwira TG, kumhanya kwakanyanya, yakakwira frequency, gobvu yemhangura yakakosha ndiro inowedzera kubhowa, kudhirowa burr uye kudhirowa kubvisa tsvina kunetseka.Mazhinji akaturikidzana, maturusi ekuchera ari nyore kutyora;CAF kutadza kunokonzerwa neyakakora BGA uye yakamanikana gomba madziro spacing zviri nyore kutungamira kune yakarerekera kudhiraivha dambudziko nekuda kwePCB ukobvu.