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4 Layer ENIG SF302+FR4 Rigid-Flex PCB

Tsanangudzo Pfupi

Layer: 4
Special Processing: Rigid-Flex Board
Pamusoro Pekupedzisira: ENIG
zvinhu: SF302+FR4
Outer Track W/S: 5/5mil
Inner Track W/S: 6/6mil
Bhodhi Ukobvu: 1.0mm
Min.Gomba Diameter: 0.3mm

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Product Detail

Mapoinzi Ekutarisisa Mudhizaini YeRigid Flexible Combination Zone

1.Mutsara unofanirwa kushanduka zvakanaka, uye kutungamira kwemutsara kunofanira kuva perpendicular kune nzira yekukotama.

2.Conductor ichagoverwa zvakaenzana munzvimbo yese yekukotama.

3.Kufara kwemutyairi kuchawedzerwa munzvimbo yese yekukotama.

4.PTH dhizaini haifanirwe kushandiswa munzvimbo yakaoma inoshanduka inoshanduka.

5.Bending radius yekukombama zone ye rigid flexible PCB

Material Of Flexible PCB

Wese munhu anoziva Rigid zvinhu, uye FR4 mhando dzezvishandiso dzinowanzoshandiswa.Nekudaro, zvakawanda zvinodiwa zvinofanirwa kuverengerwa kune yakaoma inochinjika PCB zvinhu.Inoda kuve yakakodzera kunamatira, yakanaka kupisa kupisa, kuitira kuti ive nechokwadi chekuti iyo yakaoma flexural bonding chikamu cheiyo dhigirii yekuwedzera mushure mekupisa pasina deformation.Vagadziri vese vanoshandisa resin akateedzana ezvakaomarara PCB zvinhu.

Pazvinhu zvinochinjika, sarudza substrate uye yekuvhara firimu ine diki saizi yekuwedzera uye kuderera.Kazhinji shandisa yakaoma PI yekugadzira zvinhu, asiwo yakananga kushandiswa kweasina-adhesive substrate yekugadzira.The flex zvinhu ndezvizvi:

Base Material: FCCL (Flexible Copper Clad Laminate)

PI.Polymide: Kapton (12.5 um / 20 um / 25 um / 50 um / 75um).Kunaka kuchinjika, kushomeka kwekushisa kwepamusoro (kureba kwekushandisa tembiricha ndeye 260 ° C, kwenguva pfupi 400 ° C), kunyura kwakakwirira kwehunyoro, kunaka kwemagetsi uye mashandiro emagetsi, kurwisa kwakanaka kubvarura.Kuramba kwakanaka kwemamiriro ekunze, kusagadzikana kwemakemikari uye kunonoka kwemurazvo.Polyester imide (PI) ndiyo inonyanya kushandiswa.PET.Polyester (25 um / 50 um / 75um).Yakachipa, yakanaka kuchinjika uye kuramba kubvarura.Yakanaka michina uye yemagetsi zvivakwa senge tensile simba, yakanaka kudzivirira mvura uye hygroscopicity.Asi mushure mekupisa, shrinkage rate yakakura uye tembiricha yekudzivirira haina kunaka.Haikodzeri kupisa kwekushisa kwepamusoro, kunyunguduka 250 ° C, kushoma kushandiswa

Kuvhara Membrane

Basa guru refirimu rinovhara nderokudzivirira dunhu, kudzivirira dunhu kubva kune unyoro, kusvibiswa uye welding.The Conductive Layer inogona kukungurutswa Annealed Copper, Electrodeposited Copper uye Silver Ink.Iyo crystal chimiro che electrolytic mhangura yakaoma, iyo isingakodzeri kune yakanaka mutsara goho.Calendered copper crystal chimiro chakatsetseka, asi iyo yekunamatira ine base firimu haina kunaka.Inogona kusiyaniswa kubva pakuonekwa kwemavara uye kukunguruka mhangura foil.Electrolytic copper foil ndeye copper tsvuku, calendering copper foil i grey chena.Zvimwe Zvishandiso &Stiffeners: Izvo zvinodzvanywa muchikamu cheiyo flex PCB yezvikamu zvewelding kana kuwedzera stiffeners yekuisa.Reinforcement firimu iripo FR4, resin ndiro, kumanikidza inonamira inonamira, simbi shizha aluminium pepa rekusimbisa, nezvimwe.

Isiri-inoyerera/Yakadzika Inoyerera glue semi-yakapora pepa (Low Flow PP).Yakaoma uye Flex yekubatanidza inoshandiswa kune Rigid flex PCB, kazhinji yakaonda kwazvo PP.

Zvakapfuura: 8 Layer HASL FPC+FR4 Rigid-Flex PCB

Zvinotevera: 4 Layer FPC+FR4 Rigid Flex PCB

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