Layer: 8 Indasitiri Yekushandisa: Indasitiri Kudzora Kupera kwepamusoro: ENIG W/S: 6/6mil Ukobvu: 1.6mm Min.gomba dhayamita: 0.2mm laminate:1R+2R+2F+2R+1R
Layer: 10 Kupera kwepamusoro: ENIG Nheyo yezvinhu: FR4 Kunze Layer W/S: 4.5/2.5mil Inner layer W/S: 4/3.5mil Ukobvu: 1.0mm Min.gomba dhayamita: 0.3mm
Layer: 4
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 12/5mil
Inner layer W/S: 12/5mil
Ukobvu: 1.6mm
Min.gomba dhayamita: 0.25mm
Layer: 4 Zvishandiso:FR4+Rogers 4350B Min.gomba dhayamita: 0.3mm Minimum Line Width: 0.230mm Minimum Line Space: 0.170mm Kurapa Kwepamusoro: ENIG Ukobvu: 1.0mm
Layer: 4 Indasitiri Yekushandisa: Indasitiri Kudzora W/S: 6/6mil Bhodhi Ukobvu: 0.4mm MIN.Gomba Diameter: 0.2mm Pamusoro Pekupedzisira: ENIG zvinhu: FR4 + FPC laminate:1F+2R+1R
Layer: 8 Indasitiri Yekushandisa: Indasitiri Kudzora Kupera kwepamusoro: ENIG Base zvinhu: FR4 + FPC W/S: 5/5mil Ukobvu: 1.6mm Min.gomba dhayamita: 0.2mm laminate: 2R+2F+2F+2R
Layer: 4 Special Processing: Rigid-Flex zvinhu: FR4+FPC Outer Track W/S: 4/3.5mil Yemukati Track W/S: 5/4mil Bhodhi Ukobvu: 0.5mm Min.Gomba Diameter: 0.2mm
Layer: 8 Kupera kwepamusoro: ENIG Nheyo yezvinhu: FR4 Kunze Layer W/S: 7/4mil Inner layer W/S: 5/4.5mil Ukobvu: 1.0mm Min.gomba dhayamita: 0.2mm Yakakosha maitiro: Impedance Control + Heavy Copper
Layer: 10 Kupera kwepamusoro: ENIG Nheyo yezvinhu: FR4 W/S: 4/4mil Ukobvu: 1.6mm Min.gomba dhayamita: 0.2mm Special process: Bofu Vias
Layer: 6 Kupera kwepamusoro: HASL Nheyo yezvinhu: FR4 Kunze Layer W/S: 9/4mil Inner layer W/S: 11/7mil Ukobvu: 1.6mm Min.gomba dhayamita: 0.3mm
Layer: 8 Kupera kwepamusoro: ENIG Nheyo yezvinhu: FR4 Kunze Layer W/S: 3/3mil Inner layer W/S: 3/3mil Ukobvu: 0.8mm Min.gomba dhayamita: 0.1mm Yakakosha maitiro: Mapofu & Akavigwa Vias
Layer: 6 Kupera kwepamusoro: ENIG Nheyo yezvinhu: FR4 Kunze Layer W/S: 4/4mil Inner layer W/S: 4/4mil Ukobvu: 1.2mm Min.gomba dhayamita: 0.2mm Special process:Impedance, hafu gomba
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