Layer: 8
Kupera kwepamusoro: ENIG
Nheyo yezvinhu: FR4
Kunze Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Ukobvu: 1.2mm
Min.gomba dhayamita: 0.15mm
Special process: via-in-pad
Layer: 6
Yekunze Layer W/S: 4/3.5mil
Ukobvu: 1.0mm
Min.gomba dhayamita: 0.2mm
Special process: via in pad
Layer: 10
Chiyero chezvikamu: 8:1
Kunze Layer W/S: 4/4mil
Inner layer W/S: 5/3.5mil
Ukobvu: 2.0mm
Min.gomba dhayamita: 0.25mm
Yakakosha maitiro: Impedance Kudzora, Resin Plugging, Yakasiyana Copper Hukobvu
Ukobvu dhayamita reshiyo:8: 1
Inner layer W/S: 4/3.5mil
Yakakosha maitiro: via-mu-pad, impedance control
Layer: 4 Kupera kwepamusoro: ENIG Base zvinhu: Arlon AD255+Rogers RO4003C Min.gomba dhayamita: 0.5mm Minimum W/S:7/6mil Ukobvu: 1.8mm Special process:Bofu gomba
Layer: 12 Kupera kwepamusoro: ENIG Nheyo yezvinhu: FR4 Kunze Layer W/S: 5/4mil Inner layer W/S: 4/5mil Ukobvu: 3.0mm Min.gomba dhayamita: 0.3mm Yakakosha maitiro: 5/5mil impedance control line
Layer: 6 W/S: 4/4mil Bhodhi Ukobvu: 1.6mm MIN.Gomba Diameter: 0.2mm Special Processing: chikamu 1 HDI Bofu Via:0.07mm Pamusoro Pekupedzisira: ENIG laminate: 2R+2F+2R Indasitiri yekushandisa: mota radar
Layer: 8 Kupera kwepamusoro: ENIG Nheyo yezvinhu: FR4 Kunze Layer W/S: 4/4mil Inner layer W/S: 3.5/3.5mil Ukobvu: 1.6mm Min.gomba dhayamita: 0.45mm
Layer: 4 Kupera kwepamusoro: ENIG Nheyo yezvinhu: FR4 Tg170 Kunze Layer W/S: 5.5/6mil Inner layer W/S: 17.5mil Ukobvu: 1.0mm Min.gomba dhayamita: 0.5mm Special process: Bofu Vias
Layer: 10 Kupera kwepamusoro: ENIG zvinhu: FR4 Tg170 Mutsara wekunze W/S: 10/7.5mil Mutsara wemukati W/S: 3.5/7mil Bhodhi ukobvu: 2.0mm Min.gomba dhayamita: 0.15mm Plug hole: kuburikidza nekuzadza plating
Layer: 4
Kunze Layer W/S: 9/4mil
Inner layer W/S: 7/4mil
Ukobvu: 0.8mm
Special process:Impedance, hafu gomba
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